Brief: TECOM to issue T$60 mln non-public corporate bonds

Tecom Co

09/11/2017 07:33

Nov 9 (Reuters) - TECOM Co Ltd  2321.TW  : 
       
    * Says it plans to issue 2017 1st tranche non-public 
unsecured 
corporate bonds worth T$60 million in total, with coupon rate of 
1.8 percent per annum 
    * Proceeds will be used to improve the financial structure 
and 
fulfill working capital  
 
     
    Source text in Chinese: https://goo.gl/DxzGfm 
    Further company coverage: 2321.TW  
 
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