Brief: Hp Telecom India Board Approves Loan Agreement With Kabir Technologies
04/11/2025 11:36
Nov 4 (Reuters) - HP Telecom India Ltd HPTE.NS: HP TELECOM INDIA LTD - BOARD APPROVES LOAN AGREEMENT WITH KABIR TECHNOLOGIES HP TELECOM INDIA LTD - LOAN AGREEMENT SIZE IS 100 MILLION RUPEES Source text: ID:nNSE2zP0K9 Further company coverage: HPTE.NS ((reuters.briefs@thomsonreuters.com;))