Brief: Senmiao Technology Announces Signing Of Framework Agreement With Taoyun Capital
12/04/2021 14:18
April 12 (Reuters) - Senmiao Technology Ltd AIHS.O :
* SENMIAO TECHNOLOGY ANNOUNCES SIGNING OF FRAMEWORK
AGREEMENT WITH
TAOYUN CAPITAL
* SENMIAO TECHNOLOGY LTD - ACCORDING TO TERMS OF AGREEMENT,
CO &
TAOYUN CAPITAL WILL COLLABORATE IN DEVELOPMENT OF ONLINE
RIDE-HAILING BUSINESS
Source text for Eikon: ID:nPn74Hd7Wa
Further company coverage: AIHS.O
((Reuters.Briefs@thomsonreuters.com;))
Recent news on Senmiao Technology
See all newsBrief: Senmiao Technology Ltd To Sell Up To 10,000,000 Units At $1.10 Per Unit, For Gross Proceeds Of About $11 Million
Disposes 100% Equity Interests In Yicheng And Zecheng - SEC Filing
Brief: Senmiao Technology Signs Strategic Agreement With Changsha Yipeng
Brief: Senmiao Technology Enters Acquisition Agreement With Jiangsu Yuelaiyuexing Technology, Others
Brief: Senmiao Technology Regains Compliance With Nasdaq Minimum Bid Price Listing Requirement