Brief: China Ludao Technology To Place Bonds In Aggregated Principal Amount Of Up To HK$100 Mln
12/02/2018 11:37
Feb 12 (Reuters) - China Ludao Technology Co Ltd 2023.HK :
* TO PLACE BONDS IN AN AGGREGATED PRINCIPAL AMOUNT OF UP TO
HK$100
MILLION
Source text for Eikon: urn:newsml:reuters.com:*:nHKS6TW2Bb
Further company coverage: 2023.HK
((Bangalore.newsroom@thomsonreuters.com;))
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